On January 1st, TSMC published 2017
Annual Report and
Business Overview with an info on CIS process development:
- 0.13µm SPAD technology platform speeds up customer product development of LiDAR applications. 3D imaging and sensing are becoming more important for machine vision, and LiDAR is a critical technology to serve these applications. Customers can use TSMC’s industry-leading SPAD platform to design SPAD sensors and achieve the best time-to-market, which will greatly accelerate LiDAR’s use in automotive and security industries.
- TSMC expanded its technology for optical fingerprint sensing, from 0.18µm and 0.11µm CMOS image sensors to collimator, enabling customers to customize their optical fingerprint sensors. Fingerprint sensing is a critical authentication scheme for many electronic communications and payment systems.
- A high-performance sub-micron pixel development was completed and made ready for mass production;
- QE gained significant boost on NIR sensors by innovative structure and usage of new material
- Pitch density of wafer bond technology was pushed higher to maintain the Company’s world-wide leading position
- Q&R worked with customers to complete stacked CIS Column Level Hybrid Bond (CLHB) process/product qualification and successfully shipped to customers in 2017
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