MEMS and Imaging Summit to be held in Grenoble, France on Sept. 25-27, 2019 publishes a part of its interesting agenda:
- Considerations of Optical Fingerprint and 3D Face Recognition Sensors for Cellular Security Applications, Avi Strum, SVP, TowerJazz
- Sensors in Mixed Reality, Sunil Acharya, Senior Director of Sensor Development Hololens, Microsoft
- A Touch of Finnish Sense, Antti Vasara, President & CEO, VTT
- Discovering New Dimensions: Our Vision to Sense the World, Christian Herzum, Senior Director 3D-Sensing & Discretes, Infineon Technologies
- 7.2um Pixel Event-Based Vision Sensor with Frame Readout, Raphael Berner, Head of chip design, Insightness AG
- PIXCURVE: a Global Approach for Curved Optical Components, David Henry, Head of Packaging and Assembly Laboratory, Optics and Photonics Division,CEA-Leti
- Wafer Scale Image Sensors: New Developments and Technology Challenges for the X-ray Market, Thalis Anaxagoras, Founder, ISDI
- Industrial Atomic Layer Deposition for Image Sensors, Mikko Söderlund, Director, Technical Sales Europe, Beneq
- Excellence in Microlens Imprint Lithography and Wafer-Stacking, Reinhard Voelkel, CEO, SUSS MicroOptics SA
- AI Close to the Sensor: an Approach for Energy Efficient and Real Time AI, Bram Senave, Business Development Manager, Easics
- Organic Image Sensors for Fingerprint Acquisition in Smartphone Display and NIR Development for Hybrid CMOS Imager, Benjamin Bouthinon, Optics Manager, ISORG
- 3D Depth Sensing: Time-of-Flight Technology and Application, Morin Dehan, Technology Engineer, Sony Depthsensing Solutions
- Electrowetting Based Liquid Lenses – a Novel Technology that Improves Imaging Device Performance, Frederic Laune, Corning
- Hyperspectral Imaging for Wafer Inspection, Jan Makowski, CEO / CTO, LuxFlux
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