"By moving away from pixel-level bump bonds and taking advantage of greater miniaturization in Cu-Cu Direct Bond Interconnect (DBI), Sony was able to reduce the pixel size of the InGaAs/ROIC SWIR imagers down to 5.0 µm. This makes the IMX990/IMX991 the smallest pixel-pitch InGaAs-based SWIR image sensors commercially available on the market.
Sony Semiconductor Solutions Die-to-Wafer Hybridization Advanced Packaging Process
Additionally, Sony has developed a highly scalable Die-to-Wafer Hybridization process, with wafer-level hybrid bonding to help manufacture its new SWIR imagers. In Die-to-Wafer Hybridization, a handle wafer supports an array of pre-manufactured SWIR InGaAs Die so that hybrid bonding can take place much like conventional CMOS Image Sensors CIS-to-ISP wafer-level bonding.
This approach presents two advantages, the Cu-Cu DBI can help reduce the overall height of the Die while Die-to-Wafer hybridization can help reduce the per-Die cost, thereby facilitating greater utilization of Sony’s SWIR technology for a wide range of applications."
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