SEMI MEMS & Imaging Sensors Summit 2024 will take place November 14-15 at the International Conference Center Munich (ICM), Messe Münich in Germany.
Thursday, 14th November 2024
Session 1: Market Dynamics: Landscape and Growth Strategies
09:00 Welcome Remarks
Laith Altimime, President, SEMI Europe
09:20 Opening Remarks by MEMS and Imaging Committee Chair
Philippe Monnoyer, VTT Technical Research Center of Finland Ltd
09:25 Keynote: Smart Sensors for Smart Life – How Advanced Sensor Technologies Enable Life-Changing Use Cases
Stefan Finkbeiner, General Manager, Bosch Sensortec
09:45 Keynote: Sensing the World: Innovating for a More Sustainable Future
Simone Ferri, APMS Group Vice President, MEMS sub-group General Manager, STMicroelectronics
10:05 Reserved for Yole Development
10:25 Key Takeaways by MEMS and Imaging Committee Chair
Philippe Monnoyer, VTT Technical Research Center of Finland Ltd
10:30 Networking Coffee Break
Session 2: Sustainable Supply Chain Capabilities
11:10 Opening Remarks by Session Chair
Pawel Malinowski, Program Manager and Researcher, imec
11:15 A Paradigm Shift From Imaging to Vision: Oculi Enables 600x Reduction in Latency-Energy Factor for Visual Edge Applications
Charbel Rizk, Founder & CEO, Oculi
11:35 Reserved for Comet Yxlon
11:55 Key Takeaways by Session Chair
Pawel Malinowski, Program Manager and Researcher, imec
12:00 Networking Lunch
Session 3: MEMS - Exploring Future Trends for Technologies and Device Manufacturing
13:20 Opening Remarks by Session Chair
Pierre Damien Berger, MEMS Industrial Partnerships Manager, CEA LETI
13:25 Unlocking Novel Opportunities: How 300mm-capable MEMS Foundries Will Change the Game
Jessica Gomez, CEO, Rogue Valley Microdevices
13:45 Trends in Emerging MEMS
Alissa Fitzgerald, CEO, A.M. Fitzgerald & Associates, LLC
14:05 The Most Common Antistiction Films are PFAS, Now What?
David Springer, Product Manager, MVD and Release Etch Products, KLA Corporation
14:25 Reserved for Infineon
14:45 Latest Innovations in MEMS Wafer Bonding
Thomas Uhrmann, Director of Business Development, EV Group
15:05 Key Takeaways by Session Chair
Pierre Damien Berger, MEMS Industrial Partnerships Manager, CEA LETI
Session 4: Imaging - Exploring Future Trends for Technologies and Device Manufacturing
15:10 Opening Remarks by Session Chair
Stefano Guerrieri, Engineering Fellow and Key Expert Imager & Sensor Components, ams OSRAM
15:15 Topic Coming Soon
Avi Bakal, CEO & Co-founder, TriEye
15:35 Active Hyperspectral Imaging Using Extremely Fast Tunable SWIR Light Source
Jussi Soukkamaki, Lead, Hyperspectral & Imaging Technologies, VTT Technical Research Centre of Finland Ltd
15:55 Networking Coffee Break
16:40 Reserved
17:00 Reserved for CEA-Leti
17:20 Reserved for STMicroelectronics
17:40 Key Takeaways by Session Chair
Stefano Guerrieri, Engineering Fellow and Key Expert Imager & Sensor Components, ams OSRAM
Friday, 15th November 2024
Session 5: MEMS and Imaging Young Talent
09:00 Opening Remarks by Session Chair
Dimitrios Damianos, Project Manager, Yole Group
09:05 Unlocking Infrared Multispectral Imaging with Pixelated Metasurface Technology
Charles Altuzarra, Chief Executive Officer & Co-founder, Metahelios
09:10 Electrically Tunable Dual-Band VIS/SWIR Imaging and Sensing
Andrea Ballabio, CEO, EYE4NIR
09:15 FMCW Chip-Scale LiDARs Scale Up for Large Volume Markets Thanks to Silicon Photonics Technology
Simoens François, CEO, SteerLight
09:20 ShadowChrome: A Novel Approach to an Old Problem
Geoff Rhoads, Chief Technology Officer, Transformative Optics Corporation
09:25 Feasibility Investigation of Spherically Bent Image Sensors
Amit Pandey, PhD Student, Technische Hochschule Ingolstadt
09:30 Intelligence Through Vision
Stijn Goossens, CTO, Qurv
09:35 Next Generation Quantum Dot SWIR Sensors
Artem Shulga, CEO & Founder, QDI Systems
09:40 Closing Remarks by Session Chair
Dimitrios Damianos, Project Manager, Yole Group
09:45 Networking Coffee Break
Session 6: Innovations for Next-Gen Applications: Smart Mobility
10:35 Opening Remarks by Session Chair
Bernd Dielacher, Business Development Manager MEMS, EVG
10:40 Reserved
11:00 New Topology for MEMS Advances Performance and Speeds Manufacturing
Eric Aguilar, CEO, Omnitron Sensors, Inc.
11:20 Key Takeaways by Session Chair
Bernd Dielacher, Business Development Manager MEMS, EVG
Session 7: Innovations for Next-Gen Applications: Health
11:25 Opening Remarks by Session Chair
Ran Ruby YAN, Director of HMI & HealthTech Business Line, GLOBALFOUNDRIES
11:30 Reserved
11:50 Sensors for Monitoring Vital Signs in Wearable Devices
Markus Arzberger, Senior Director, ams-OSRAM International GmbH
12:10 Pioneering Non-Invasive Wearable MIR Spectrometry for Key Health Biomarkers Analysis
Jan F. Kischkat, CEO, Quantune Technologies GmbH
12:30 Key Takeaways by Session Chair
Ran Ruby YAN, Director of HMI & HealthTech Business Line, GLOBALFOUNDRIES
12:35 End of Conference Reflections by MEMS and Imaging Committee Chair
Philippe Monnoyer, VTT Technical Research Center of Finland Ltd
12:45 Closing Remarks
Laith Altimime, President, SEMI Europe
12:50 Networking Lunch
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