Link: https://www.techinsights.com/blog/samsung-unveils-first-imager-featuring-hybrid-bond-technology
In a recent breakthrough discovery by TechInsights, the Samsung GM5 imager, initially thought to be a standard back-illuminated CIS, has been revealed to feature a pioneering hybrid bond design. This revelation comes after a year-long investigation following its integration into the Google Pixel 7 Pro.
Initially cataloged as a regular back-illuminated CIS due to the absence of through silicon vias (TSVs), further analysis was prompted by its appearance in the Google Pixel 8 Pro, boasting remarkable resolution. This led to an exploratory cross-section revealing the presence of a hybrid bond, also known as Direct Bond Interconnect (DBI).
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