BusinessWire,
PRNewswire: SMIC and Invensas, a subsidiary of Xperi, announce the establishment of Invensas’ Direct Bond Interconnect (DBI) at SMIC’s Avezzano facility (former LFoundry).
“
Invensas’ DBI technology enables SMIC to manufacture the high performance image sensors required in mobile, automotive, and consumer electronics applications,” said Sunny Hui, SVP of marketing at SMIC. “
With this technology in place, SMIC is prepared to further expand this capability into volume manufacturing around the globe, both at 200mm and 300mm.”
“
SMIC’s talented manufacturing team has done an excellent job integrating our DBI process into their high-volume manufacturing environment,” said Craig Mitchell, president of Invensas. “
We are thrilled to announce that SMIC is ready to engage commercial customers and support the demand for high volume production of BSI image sensors with DBI.”

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