Minimal Fab process implements most of the steps needed for image sensor production, even a wafer thinning and bonding option. The most notable omission is a high energy ion implantation.
AIST presents Minimal Fab advantages:
There is a similar Futrfab work in the US promoting 2-inch wafer fab. However, its progress appears to be slow and it is far from being a market-ready solution for now.
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