ADI Unveils 1MP 3.5um Pixel BSI ToF Sensor

Analog Devices unveils what appears to be the first fruit of cooperation with Microsoft ToF group (former Canesta). The ADSD3100 sensor targets smartphones, AR/VR systems, and machine vision applications in logistics, inventory, industrial, and consumer fields.

The new sensor features:

1024 (horizonal) × 1024 (vertical) pixel array
3.5 μm × 3.5 μm square pixels
1/3.6 inch optical format
BSI
Depth and intensity imaging
4-wire SPI or 2-wire I2C serial interface
Die size: 5.364 mm × 9.799 mm
MIPI CSI-2 Tx interface with support for 1, 2, or 4 data lanes, programmable up to 1.5 Gbps per lane
Dual, 3.3 V and 1.27 V external supplies, 1.8 V I/O section