Besi and EVG Address Die-to-Die and Die-to-Wafer Hybrid Bonding Needs

GlobeNewswire: Applied Materials and BE Semiconductor Industries N.V. (Besi) announced an agreement to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding.

Applied and Besi have formed a joint development program and are establishing a Center of Excellence focused on next-generation chip-to-chip bonding technology. The program harnesses the companies’ respective front- and back-end semiconductor expertise to deliver co-optimized integrated hybrid bonding configurations and equipment solutions for customers.

A complete die-based hybrid bonding equipment solution requires a broad suite of semiconductor manufacturing technologies along with high-speed and extremely precise chiplet placement technology. To achieve this, the joint development program brings together Applied’s semiconductor process expertise in etch, planarization, deposition, wafer cleaning, metrology, inspection and particle defect control with Besi’s leading die placement, interconnect and assembly solutions.

PRNewswire: Wafer-to-wafer (W2W) hybrid bonding, which involves stacking and electrically connecting wafers from different production lines, is a central process in heterogeneous integration and has a proven track record of success for certain applications such as CMOS sensors. However, in cases where the components or dies are not the same size, die-to-wafer (D2W) hybrid bonding offers a viable pathway to heterogeneous integration. With its new D2W EVG320 activation system EVG supports D2W bonding applications.

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